The thermal conductivity of ZT aluminum alloy is more than twice that of similar international aluminum alloys. For electronic products that are getting smaller in size and higher in integration, heat dissipation is an important factor determining the performance of electronic products. The high thermal conductivity of ZT aluminum alloy makes it the best material choice for efficient heat dissipation devices in electronic products. The specific applications are as follows:

intel casket-type computing module

Overall dimensions of the machine: 94.0×55.0×5.0mm

The casing is cast with ZT aluminum-based nanocrystalline alloy, with a minimum shell thickness of 0.2mm and an anodized appearance

intel Chandler Bay computing module

Overall dimensions of the machine: 251.0×49.4×36.0mm

The casing is cast with ZT aluminum-based nanocrystalline alloy, and the shell is designed in the form of heat sinks

CHESSIS_MAIN_BRAVO_INTEL computing module

Overall dimensions of the machine: 154×108×21mm

The casing is cast with ZT aluminum-based nanocrystalline alloy, and the shell is designed in the form of heat sinks

CHESSIS_MAIN_TALL_BRAVO_INTEL computing module

Overall dimensions of the machine: 154×108×29mm

The casing is cast from ZT alloy, and the shell is designed in the form of heat sinks